AM29LV256ML123FI datasheet

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• Маркировка
  AM29LV256ML123FI
• Производитель
  AMD (Advanced Micro Devices)
• Описание
  AMD (Advanced Micro Devices) AM29LV256ML123FI Mfr Package Description: REVERSE, MO-142B, TSOP-56 Package Shape: RECTANGULAR Package Style: SMALL OUTLINE, THIN PROFILE Surface Mount: Yes Terminal Form: GULL WING Terminal Pitch: 0.5000 mm Terminal Position: DUAL Number of Functions: 1 Number of Terminals: 56 Package Body Material: PLASTIC/EPOXY Temperature Grade: INDUSTRIAL Memory Width: 16 Organization: 16M X 16 Memory Density: 2.68E8 deg Operating Mode: ASYNCHRONOUS Number of Words: 1.68E7 words Number of Words Code: 16M Alternate Memory Width: 8 Operating Temperature-Max: 85 Cel Operating Temperature-Min: -40 Cel Supply Voltage-Max (Vsup): 3.6 V Supply Voltage-Min (Vsup): 2.7 V Supply Voltage-Nom (Vsup): 3 V Memory IC Type: FLASH 3V PROM Parallel/Serial: PARALLEL Access Time-Max (tACC): 120 ns
• Количество страниц
  68 шт.
• Формат
  PDF

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• Размер файла
  751,30 KB

AM29LV256ML123FI datasheet скачать

AM29LV256ML123FI datasheet